New England Chinese Information and Networking Association (NECINA)

NECINA SemiTech Special Interest Group (SIG) Seminar

   Time: 6:30pm to 9:00pm, Thursday, April 16, 2009 
Venue: Foley Hoag LLP, 1000 Winter St, North Entrance, Suite 4000, Waltham, MA

To register, please go to http://www.acteva.com/booking.cfm?bevaid=180095

·        Topics:            

o        Technologies for Analog, Mixed Signal, RF and mmWave ICs

Analog and RF ICs are key enablers for advanced communications which have dramatically changed our daily life in many ways. This talk will first review the semiconductor IC market and the evolving applications. It will then cover different technology options and technology roadmap from leading foundry for analog/RF/mmWave IC designs. Device menus for advanced RFCMOS, SiGe BiCMOS, and high performance RF passives will be presented. It will provide insightful guidance in choosing proper technologies for appropriate applications with considerations of device performance scaling impact, system requirement, and cost.

o        CMOS Silicon on Insulator:  Enabling changes in RF designs 

Silicon on insulator (SOI) refers to the use of an insulator substrate instead of conventional silicon substrates in semiconductor manufacturing to reduce device parasitic and improve performance. After a journey of more than 20 years and leveraging with low currents consumption and high speed, SOI triumphantly shows off its successes in digital and mixed signal IC, from processors to game consoles. Benefiting from low cost and high integration, it is also quietly reaching into high performance RF/MW field which traditionally is dominated by III-V compound. The purpose of this talk is to give an overview of SOI from RF circuit designers' perspective, and to share with you what SOI has substituted, and what kind of innovations may be enabled in multi-mode multi-band front end module as well as in millimeter wave fields.

·        Agenda            

6:30pm-7:00pm Networking (Pizza will be served)

7:00pm-7:40pm RF/Analog Technology (Dawn Wang )

7:40pm-7:55pm Questions and Answers

7:55pm-8:15pm RF CMOS SOI (Dr. Yang Li )

8:15pm-8:30pm Questions and Answers

8:00pm-9:00pm Networking

·        Speakers            

Dawn Wang is a senior foundry application engineer in IBM Microelectronics. She had also held various senior technical positions in Texas Instruments and TriQuint Semiconductors in technology and product development for RF, Analog/Mixed Signal (AMS) integrated circuits. Dawn has published technical papers and holds US patents in RF/AMS designs. She is a member in wireless working group of International Technology Roadmap of Semiconductor (ITRS).

Dawn Wang received her BSEE and MSEE from Tsinghua University in China. She also received her M. S. in Solid State Physics from Arizona State University.

Dr. Yang Li is a principal engineer in Skyworks developing 3G/LTE power amplifier and front-end module. Before joining Skyworks, he was with Peregrine Semiconductor working on RF front-end designs on SOI. He also co-founded XEL focusing on short-range wireless communication technologies.

Yang Li received his B.S. and Ph.D. in Electronic Engineering from Tsinghua University, Beijing, China, in 1996 and 2001, respectively.

·        Registration:

This event is open to all public. To register, please go to http://www.acteva.com/booking.cfm?bevaid=180095

Organizers: Bo Zhang<bzhg2000@...>, Dawn Wang <dawn_wang@...> and Yang Li <edwardliyang@...>

For more information, please visit the following sites

NECINA Semi SIG:  http://www.yahoogroups.com/groups/necina_sig_semiconductor

NECINA: http://www.necina.org/

Event Sponsor: Foley Hoag LLC http://www.foleyhoag.com/