Hello,

SiO2 is a subliming material.  A stationary beam position will 'drill a hole' at
the center. An XY sweep at high frequencies is required during deposition.

SAGE industrial sales, inc.
PAM LUECKE



-----Original Message-----
From: Zhuo Yu <yayulo@...>
To: PVD_coatings@yahoogroups.com
Sent: Mon, Nov 16, 2009 9:04 am
Subject: [PVD_coatings Forum] SiO2 evaporation issues




Dear all,

I tried to deposit 100nm SiO2 film using e-beam PVD. The source
material is 1-3mm pieces of chunks in a 25mm-diameter crucible. I met
some problems with these experiments. First, the beam always drilled a
hole at the center of source surface. I tried to modify the beam
pattern but it didn't help much so far. Second, the films had an
optical index gradient with deposition time. this might be caused by
the composition changes during the deposition process.

Does anybody have experience with this material? How did you solve those
problems? Any suggestions are very appreciated.

Regards,

Zhuo

[Non-text portions of this message have been removed]







[Non-text portions of this message have been removed]

SiO2 heats in a very uneven way.  It is a subliming material, meaning it
transitions in evaporation from a solid state - directly to a gas state.  It
never become a molten liquid.  The result is uneven heat dissipation and corners
and edges of granules or broken powders getting super heated and popping before
the material just below the hot surface gets hot.  The non uniform heating
results in tunneling and presents a challenge for granule type evaporation.

On the other hand, the finer the granules the more surface area is available to
trap and hold water vapor.  This vapor does not free itself from the SiO2 until
the powders are heated.  Therefore the first act of heating produces gases of
water vapor which in turn promote arcing.  Arcing can move the powders and make
the problem worse allowing even more gas to emerge from the powder charge until
it is totally out-gassed.  Therefore a right combination of fast arc recovery
power supply and high resolution sweep is shown to abate the tunneling the
issue.

An intelligently designed high resolution sweep pattern with discrete (e.g.
1024) points can be used to make the heating as uniform as possible. in
conjunction with a fast arc recovery (< 3ms) power supply will ensure a higher
average power that will liberate moisture out of the media that can then be
pumped out thus providing an arc free environment for deposition.

all the above mentioned happens before the shutter opens for deposition, i.e.
during the ramp and soak time. thus when the shutter opens a uniform surface
topography and arc-less environment the media remains stable and therefore
delivers a uniform evaporation rate, greater film uniformity and a higher
probability of uniform composition.

Power Supply suggested : Temescal CV-6SLX
Sweep : Temescal Super Sweep 64.

Imran Amirani
Temescal Edwards Vacuum
imran_amirani@...


--- In PVD_coatings@yahoogroups.com, Zhuo Yu <yayulo@...> wrote:
>
> Dear all,
>
>
>
> I tried to deposit 100nm SiO2 film using e-beam PVD. The source
> material is 1-3mm pieces of chunks in a 25mm-diameter crucible. I met
> some problems with these experiments. First, the beam always drilled a
> hole at the center of source surface. I tried to modify the beam
> pattern but it didn't help much so far. Second, the films had an
> optical index gradient with deposition time. this might be caused by
> the composition changes during the deposition process.
>
> Does anybody have experience with this material? How did you solve those
problems? Any suggestions are very appreciated.
>
>
>
> Regards,
>
>
>
> Zhuo
>
>
>
>
> [Non-text portions of this message have been removed]
>

I agree with Mr.Bishop recommendations and would like just to add a little bit
more. If you have a good programmable e-beam sweeper, defocus beam over material
in the liner providing on the periphery more power density than in the center;
it allows to obtain more or less uniform evaporation. We use to use solid SiO2
plugs adding for the each next run SiO2 chunks in the evaporated hole.

Oxygen pressure (2 - 6)x10-5 torr usually is OK for good SiO2 layers at about 3
- 4 A/s deposition rate. No problems with e-gan and its filament. At 7 kV and
about 130-150 mA e-beam current we can deposit, I guess, at least 200 - 400 nm
SiO2 film without thru hole in Dia.25 mm SiO2 plug filled with Sio2 chunks. Of
course, it strongly depends on process geometry and a chamber dimensions.

Best regards,

Vladimir Chutko

--- In PVD_coatings@yahoogroups.com, Zhuo Yu <yayulo@...> wrote:
>
> Dear all,
>
>
>
> I tried to deposit 100nm SiO2 film using e-beam PVD. The source
> material is 1-3mm pieces of chunks in a 25mm-diameter crucible. I met
> some problems with these experiments. First, the beam always drilled a
> hole at the center of source surface. I tried to modify the beam
> pattern but it didn't help much so far. Second, the films had an
> optical index gradient with deposition time. this might be caused by
> the composition changes during the deposition process.
>
> Does anybody have experience with this material? How did you solve those
problems? Any suggestions are very appreciated.
>
>
>
> Regards,
>
>
>
> Zhuo
>
>
>
>
> [Non-text portions of this message have been removed]
>

Subject: What is the procedure to obtain texturization of (100) silicon
using NaOH+isopropanol?



Dear colleagues,



Texturization of (100) Silicon (used to reduce reflectance of silicon solar
cells) has been made through the solution composed of NaOH (1-4 % weight) +
Isopropanol  (3% to 9 %) at 75-850C (5-50minutes). We have done that
successfully. However, the process seems to be very critical (and tricky)
concerning the preparation of the surface of the silicon wafer prior and
during the beginning of the etching process. Thus, very frequently the
process of texturization does not work (even using the same procedure). Does
anyone could give me some clue on how to improve the reproducibility of this
process?



Francisco C. Marques

hi

you can't avoid cavity effect(hole drilling) while evaporation of sio2 by EB
gun.Try to evaporate it with higher rate(>10A/s).Disassociation of Sio2 during
evaporation is very minimal.Ion assisted deposition with oxygen ions can solve
the gradient index problem. Evaporation by resistant boats minimizes cavity
effect.

Does anybody have experience with e-beam evaporated ZnO:Al thin films? I know
they are deposited mainly by sputtering and pyrolysis, but I heard that some
folks got good results and with e-beam evaporation....

Thank you. Any information, links are appreciated!

Hi Zhuo,

CAB's answer is correct (defocus the beam). Also you can try decreasing the
voltage on the beam, I find less than 7.5kV is better for SiO2 and other similar
materials which sublimate. When you do that, you need to add shunts to the
electron beam so that it still hits the pocket. Be persistent with developing a
beam pattern as it does take trial and error.

Regards,
Loretta Fendrock

--- In PVD_coatings@yahoogroups.com, Zhuo Yu <yayulo@...> wrote:
>
> Dear all,
>
>
>
> I tried to deposit 100nm SiO2 film using e-beam PVD. The source
> material is 1-3mm pieces of chunks in a 25mm-diameter crucible. I met
> some problems with these experiments. First, the beam always drilled a
> hole at the center of source surface. I tried to modify the beam
> pattern but it didn't help much so far. Second, the films had an
> optical index gradient with deposition time. this might be caused by
> the composition changes during the deposition process.
>
> Does anybody have experience with this material? How did you solve those
problems? Any suggestions are very appreciated.
>
>
>
> Regards,
>
>
>
> Zhuo
>
>
>
>
> [Non-text portions of this message have been removed]
>

Hi Everybody,
                       Can i get different colour shed on CLEAR FLOAT GLASS in
SPUTTERING SYSTEM
like Blue, Green, Red,Yellow.



Regards,

Rajendra Yadav



[Non-text portions of this message have been removed]

Hello,

We have a sever adhesion problem with the deposition of 0.5um Al film on
stainless steel ferule by E gun.
Is there any way to increase the adhesion? (cleaning process, adhesion layer,
etc.)
We have the option to change the ferule material to Zr, Is it going to make our
life easier?

Thank you,
Meni Kabla

I am not sure of what you really want as TEM is transmission electron microscopy
and simply scratching a film does not normally produce TEM samples.  In the
past when wanting TEM samples I have potted up a small sample of the film
usually edge on so that when using an ultramicrotome to shave off a thin sliver
I have samle cutting through the film and coating which is supported by the
potting compound.

If you were wanting a sample for scanning electron microscopy (SEM) then there
are various options. One is to support the film on either side and cut through
the sample so that you have as clean an edge as possible.  This is not always
easy to do and depends on how sharp the knife or scissors is.  An alternative
is to freeze the sample using liquid nitrogen and snap the sample so that you
get a fracture surface.  Another is to pull the sample using a tensile testing
system or bend the sample under tension and look at the crack edges.

If you want to look at scratch damage then there are systems that use a stylus
to scratch the substrate and as the stylus moves the load is increased.  The
more modern systems use acoustic emission to listen for the first signs of
coating failure and the scratch continues until failure has occurred. This
scratch is then examined using SEM to determine th etype of failure.   Teer
Coatings are one company who I believe can halp you if this is the type of
system you are interested in.

I hope this helps.
CAB
C.A.Bishop Consulting Ltd.    www.cabuk1.co.uk 




________________________________
From: Arun kumar <d_arun1981@...>
To: PVD_coatings@yahoogroups.com
Sent: Saturday, 14 November, 2009 9:25:11
Subject: [PVD_coatings Forum] TEM - reg

 
Dear All,

Can anyone suggest how to scratch thin film samples to take TEM measurements.

Arun Kumar. D

[Non-text portions of this message have been removed]




[Non-text portions of this message have been removed]

There are many possible problems that you may be experiencing.  One is the loss
of the anode for the sputtering process.  If you are sputtering metals the
scattered material will be coating the system and will be a very thin coating
which may be easily oxidised. The oxide will be non-conducting and so over a
period of time you may have converted the sputtering anode to being
non-conducting.  The anode may be either a specific anode or may simply be
using the vacuum system as the earth but both can be affected in this way
although it may occur on different timescales. Cleaning the surfaces of
scattered material on a regular basis can be important.

Arcs form for several reasons and one is from sources of electron concentration.
This can be a hot spot or a sharp point or edge. If you one form an arc the
damage to the surface may remain as an initiation source for future arcs.  When
examining you target also look for damage to the edges, feeling the surface
roughness to see if there are any shar points.  If there are smooth these back
down. This also applies to any earth or dark space shields, they too need to be
clean and smooth. 

You mentioned that you may have used the magnetron without suitable water
cooling for a time.  This can be damaging to the magnetron magnetics. Some
magnetic materials can be degraded by heat and the magnetic field decreased
permanently.  If this is the case the magnetron performance can be reduced as
the loss of electrons will be greater which means the plasma will have to be run
at a higher voltage for the same current.  As there will be fewer electrons to
undergo ionising collisions it can mean that striking the plasma may be more
difficult too.   Any dark space shields may no longer be ideally spaced if the
magnetic performance has been changed.

The other possible problem would be if the pressure had changed allowing any
dark space shield to no longer be closer than the mean free path.  If the
pressure is showing to be the same it may be worth checking that the gauge is
still in calibration and that you really do not have a pressure change.

I hope this helps.
CAB
C.A.Bishop Consulting Ltd    www.cabuk1.co.uk 




________________________________
From: moema martins <moema_m@...>
To: pvd_coatings@yahoogroups.com
Sent: Monday, 16 November, 2009 19:57:40
Subject: [PVD_coatings Forum] Instability on DC magnetron sputtering

 

Hello!
I have been working on a sputtering equipment which has been functioning just
fine, until 2 weeks ago. We use a MAK magnetron sputtering source working on a
DC power supply and metallic targets. Even though the sputtering conditions
haven't been changed, I cannot have a stable plasma anymore and noticed sparks
(arc) coming from the sides of the target. The target-to-copper contact paste is
been oxidised. I thougt it was a target problem, so I have tried changing the
target itself (from Al to Ti and a new Al), the copper backing plate, the
keeper, the paste - several times. We have already checked the magnets also,
which look ok. Nothing seems to resolve the problem.
Does anyone has a clue on what the problem could be? Could it be a problem on
the source caused by lack of water for a few minutes? Is it possible that it is
not balanced anymore?
Thanks a lot,
moema

--
Moema Martins
MSc Student
PEMM/COPPE/UFRJ
tel. 55 21 2562 8527
cel. 55 21 8810 0034







____________ _________ _________ _________ _________ _________ _
Windows Live: Keep your friends up to date with what you do online.
http://www.microsof t.com/middleeast /windows/ windowslive/ see-it-in-
action/social- network-basics. aspx?ocid= PID23461: :T:WLMTAGL: ON:WL:en-
xm:SI_SB_ 1:092010

[Non-text portions of this message have been removed]




[Non-text portions of this message have been removed]

Dear colleagues,

our paper "Elastic and Conductive Properties of Plasma-Sprayed Ceramic
Coatings in Relation to Their Microstructure: An Overview"
is now available for free access at

http://www.springerlink.com/content/r00p7595775022ut/fulltext.pdf


Igor Sevostianov

Isolate the copper coils and attach 13,56 rf to the coils. using a control
leak, vent air back into the chamber to a pressure od 1.0 to 2.0 x 10-4
evaporate the aluminum oxide at a slow rate for the first 1000 ang (egun)
The rf will cause a wrap effect and maintain a strong crystal form. We have
  put down layers up to 1 mil,
crystal clear , with this method.


Marion Shafer


[Non-text portions of this message have been removed]

To be more gentle and uniform on the heating you might try to defocus the e-beam
so that it heats a larger area and relies less on moving the beam around.
Silica can undergo dissociation and loose oxygen under the influence of the
e-beam.
It is possible to add oxygen to bring the stoichiometry back to what is
required.  It does depend on the type of e-beam gun how you do this. What you
want to make sure of is that the electron beam source of electrons is protected
from the oxygen particularly if it is from a tungsten filament.   If you are
using a 270 deg e-beam gun then using a plate to separate the filament from the
crucible & the rest of the system but with a small hole for the e-beam to pass
through will allow you to add some pumping to the filament side and have a
differential pressure enabling you to safely add oxygen near the substrate.

CAB
C.A.Bishop Consulting Ltd       www.cabuk1.co.uk  



________________________________
From: Zhuo Yu <yayulo@...>
To: PVD_coatings@yahoogroups.com
Sent: Monday, 16 November, 2009 16:04:38
Subject: [PVD_coatings Forum] SiO2 evaporation issues

 
Dear all,

I tried to deposit 100nm SiO2 film using e-beam PVD. The source
material is 1-3mm pieces of chunks in a 25mm-diameter crucible. I met
some problems with these experiments. First, the beam always drilled a
hole at the center of source surface. I tried to modify the beam
pattern but it didn't help much so far. Second, the films had an
optical index gradient with deposition time. this might be caused by
the composition changes during the deposition process.

Does anybody have experience with this material? How did you solve those
problems? Any suggestions are very appreciated.

Regards,

Zhuo

[Non-text portions of this message have been removed]




[Non-text portions of this message have been removed]

Hi,
 
You can try to use ALD.
 
Regards
 
Qi Fang

--- On Tue, 17/11/09, R Sridhar <srisri@...> wrote:


From: R Sridhar <srisri@...>
Subject: [PVD_coatings Forum] Ceramic coating
To: PVD_coatings@yahoogroups.com
Date: Tuesday, 17 November, 2009, 9:15


 



Dear All,
Can anyone suggest the best way of coating the ceramic, aluminium oxide on to
the copper coils which are to used inside the vacuum chambers. UHV
compatibility, high voltage insulation and high sticking coefficient are the key
requirement as the coils might have a lot of vibration during operation and the
coating should b e able to sustain the insulation property.

Thanking you

Regards

R Sridhar

[Non-text portions of this message have been removed]











[Non-text portions of this message have been removed]

Dear Moema



There seem to be cleaning and leakage problem. please check



Zafar



To: pvd_coatings@yahoogroups.com
From: moema_m@...
Date: Mon, 16 Nov 2009 17:57:40 -0200
Subject: [PVD_coatings Forum] Instability on DC magnetron sputtering






Hello!
I have been working on a sputtering equipment which has been functioning just
fine, until 2 weeks ago. We use a MAK magnetron sputtering source working on a
DC power supply and metallic targets. Even though the sputtering conditions
haven't been changed, I cannot have a stable plasma anymore and noticed sparks
(arc) coming from the sides of the target. The target-to-copper contact paste is
been oxidised. I thougt it was a target problem, so I have tried changing the
target itself (from Al to Ti and a new Al), the copper backing plate, the
keeper, the paste - several times. We have already checked the magnets also,
which look ok. Nothing seems to resolve the problem.
Does anyone has a clue on what the problem could be? Could it be a problem on
the source caused by lack of water for a few minutes? Is it possible that it is
not balanced anymore?
Thanks a lot,
moema

--
Moema Martins
MSc Student
PEMM/COPPE/UFRJ
tel. 55 21 2562 8527
cel. 55 21 8810 0034







__________________________________________________________
Windows Live: Keep your friends up to date with what you do online.
http://www.microsoft.com/middleeast/windows/windowslive/see-it-in-action/social-\
network-basics.aspx?ocid=PID23461::T:WLMTAGL:ON:WL:en-xm:SI_SB_1:092010

[Non-text portions of this message have been removed]





_________________________________________________________________
Windows Live: Friends get your Flickr, Yelp, and Digg updates when they e-mail
you.
http://www.microsoft.com/middleeast/windows/windowslive/see-it-in-action/social-\
network-basics.aspx?ocid=PID23461::T:WLMTAGL:ON:WL:en-xm:SI_SB_3:092010

[Non-text portions of this message have been removed]

Dear Colleagues,


We are pleased to announce the 4th MPA Meeting (International Meeting on
Developments in Materials, Processes and Applications of Emerging Technologies)
to be held in Braga, Portugal during 28-30 July 2010. More details on this
meeting on www.mpa-meeting.com


The topics for MPA 2010 include:

1. Commercialisation of Advanced Technologies (Nanotechnology)

2. Surface Technology (Coatings; Thick & Thin Films; Surface Fabrication,
Modification & Characterisation)

3. Nanomaterials for Energy Applications

4. Applied Bio-Nanotechnology

5. Carbon Nanotubes/Wires/Rods & their Applications

6. Advanced Nanometrology and Nanomanufacturing Techniques



MPA-2010 HIGHLIGHTS

Plenary lecture – The plenary lecture will be given by a very prominent person.
Details about the plenary lecture will follow very soon.

Invited talks - there will be a host of invited people from academia and
industry.

Posters - there will be poster display sessions in between the technical talks.
We are looking to give out prizes for the best posters.

Oral contributions - people from academia and those from industry or those doing
applied research will be given the opportunity to give short presentations on
their most recent work.

Exhibition - companies will have the opportunity to exhibit during this event
which will attract people from all over the world.

Short courses - short courses about special topics relating to nanofabrication ,
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Nanofabrication techniques, Bionanosystems, Nano-entrepeneurship, Clean room
maintenance, etc.).

Interactive discussion forum - the conference will end with an interactive open
discussion forum consisting of academics and industrialists all under one roof
discussing issues relating to materials, processes and applications of
nanotechnology.

Publications - Papers presented at MPA-2010 will be considered for publication
in special issues of the following journals:

Journal of Nanoscience and Nanotechnology (JNN)

Journal of Nano Research (JNanoR)


You can submit your abstracts by sending them to abstracts@... by 15
April 2010


Looking forward to receiving your abstracts


Sincerely



MPA 2010 Team.

___________________________________

4th MPA 2010

INNOSPACE, 2nd Floor, Minshull House
Chorlton Street, Manchester
M1 3FY, United Kingdom

Tel: +44 (0) 161 921 8172
Fax: +44 (0) 161 247 6820
Email: info@...

www.mpa-meeting.com

Dear All,
Can anyone suggest the best way of coating the ceramic, aluminium oxide  on to
the copper  coils which are to used inside the vacuum chambers. UHV
compatibility, high voltage insulation and high sticking coefficient are the key
requirement as the coils might have a lot of vibration during operation and the
coating should b e able to sustain the insulation property.

Thanking you

Regards

R Sridhar

[Non-text portions of this message have been removed]

Âû ïèñàëè 10 ?????? 2009 ?., 17:52:50:

>
>   
>
>
>
> Call for Papers
>
>  The American Society of Mechanical Engineers (ASME) 10th Biennial
> Conference on Engineering Systems Design and Analysis (ESDA 2010)
> will be held in Istanbul, Turkey from 12 to 14 July 2010.
>
>  The conference will cover the whole spectrum of mechanical
> engineering field (please see conference website for a complete list of topics
at:
>
>  http://www.asmeconferences.org/ESDA2010/
> <http://www.asmeconferences.org/ESDA2010/>
>
>  I'd like to particularly encourage you to submit an abstract to
> the Advanced Materials and Tribology Track Area. The main focus of
> this Track is on the latest developments in materials and tribology fields.
>
>  In the field of tribology, the main emphasis will be on the
> fundamentals of tribology (friction, wear and lubrication); surface
> engineering and treatments; texturing; advanced tribological
> coatings (including superhard, nanocomposite, and self-lubricating
> coatings like diamondlike carbon); engine and drivetrain tribology;
> tribology of high speed machining; thermal and fluid dynamics in
> lubricated contacts; transient conditions; lubrication fundamentals
> (including hydrodynamic, mixed and boundary lubrication,
> tribochemistry); ecotribology; contact mechanics; bearings and
> gears; seals; bio-tribology; micro/nanotribology; MEMS and NEMS.
>
>  In the materials field, we will be emphasizing latest developments
> in nanomaterials, metallic, composite, and polymeric materials;
> electronic and optical materials; shape memory alloys; high
> temperature materials; materials handling; corrosion and oxidation
> of materials; advances in materials processing and manufacturing;
> modern casting and powder metallurgical techniques; nondestructive
> testing; elasticity and viscoelasticity; computational materials
> science and numerical simulations; materials in micro and
> nano-mechanical systems and structures.
>
>  Important Dates
>
>  Abstract Submission Deadline
>
>  Author Notification of Abstract Acceptance
>
>  Submission of Full Paper for Review
>
>  Author Notification of Paper Acceptance
>
>  Submission of Copyright Form*
>
>  Submission of Final Accepted Paper
>
>  November 16, 2009
>
>  December 21, 2009
>
>  January 25, 2010
>
>  March 15, 2010
>
>  March 31, 2010
>
>  April 16, 2010
>
>  *Copyright transfer forms are requested upon acceptance of the
> draft and prior to the submittal of the final paper.
>
>  Programme
>
>  The scientific programme will consist of plenary lectures by
> invited keynote speakers, invited sessions and contributed paper
> presentations. All contributed papers will be subjected to a review
> process. All accepted papers will be published by ASME
> <http://www.asme.org/>  as a CD of the proceedings. For each
> accepted paper, at least one author is requested to register for the
conference.
>
>  Venue
>
>  Yeditepe University has the advantage of being situated in
> Istanbul <http://www.en.istanbul2010.org/INFO/index.htm> , the
> largest city in Europe and the former capital of three empires
> (Eastern Roman, Byzantine and Ottoman). It is a historical centre of
> Islam, Orthodox and Eastern Christianity. Since the fall of the
> Ottoman Empire, Istanbul has continued to be the major city, if not
> the titular capital the Republic of Turkiye, which has inspired 20th
> Century movements of national liberation and secular reform. As the
> commercial centre of modern Turkey, it continues to link Europe to
> Asia, and the Black Sea to the Mediterranean. The people of Istanbul
> have roots, and continuing links with Central Asia, the Caucasus,
> the Middle East and Europe. Owing to its unique historical and
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> selected as the "2010 European Culture Capital
> <http://www.en.istanbul2010.org/index.htm> "
>
>  YouTube - ISTANBUL 2010 (European Capital of Culture)
> <http://www.youtube.com/watch?v=znt5o0F2tVU>
>
>  Further Information
>
>  Further information can be obtained from the ESDA 2010 Conference website:
>
>  http://www.asmeconferences.org/ESDA2010/
> <http://www.asmeconferences.org/ESDA2010/>
>
>  Ali Erdemir, Ph.D. (Materials and Tribology Track Chair)
>
>  Argonne National Laboratory
>
>  Energy Systems Division
>
>  Tribology Section
>
>  Argonne, IL 60439
>
>  USA
>
>  Erdemir@...
>
>
>
>
>
>
>
>  __________ Information from ESET NOD32 Antivirus, version of virus
> signature database 4565 (20091102) __________
>
>  The message was checked by ESET NOD32 Antivirus.
>
>  http://www.eset.com
>
>


--
Ñ óâàæåíèåì,
  Lab#67                          mailto:shurzag@...

[Non-text portions of this message have been removed]

Dear all,



I tried to deposit 100nm SiO2 film using e-beam PVD. The source
material is 1-3mm pieces of chunks in a 25mm-diameter crucible. I met
some problems with these experiments. First, the beam always drilled a
hole at the center of source surface. I tried to modify the beam
pattern but it didn't help much so far. Second, the films had an
optical index gradient with deposition time. this might be caused by
the composition changes during the deposition process.

Does anybody have experience with this material? How did you solve those
problems? Any suggestions are very appreciated.



Regards,



Zhuo




[Non-text portions of this message have been removed]

Hello!
I have been working on a sputtering equipment which has been functioning just
fine, until 2 weeks ago. We use a MAK magnetron sputtering source working on a
DC power supply and metallic targets. Even though the sputtering conditions
haven't been changed, I cannot have a stable plasma anymore and noticed sparks
(arc) coming from the sides of the target. The target-to-copper contact paste is
been oxidised. I thougt it was a target problem, so I have tried changing the
target itself (from Al to Ti and a new Al), the copper backing plate, the
keeper, the paste - several times. We have already checked the magnets also,
which look ok. Nothing seems to resolve the problem.
Does anyone has a clue on what the problem could be? Could it be a problem on
the source caused by lack of water for a few minutes? Is it possible that it is
not balanced anymore?
Thanks a lot,
moema

--
Moema Martins
MSc Student
PEMM/COPPE/UFRJ
tel. 55 21 2562 8527
cel. 55 21 8810 0034







_________________________________________________________________
Windows Live: Keep your friends up to date with what you do online.
http://www.microsoft.com/middleeast/windows/windowslive/see-it-in-action/social-\
network-basics.aspx?ocid=PID23461::T:WLMTAGL:ON:WL:en-xm:SI_SB_1:092010

[Non-text portions of this message have been removed]

Dear Frankoo
What is the package for students
 
 
Rizwan-Ur-Rehman Sagar
M.S (Material Science/Nanoscience & Technology )
Department of Physics
COMSATS Institute of Information Technology, Islamabad Pakistan.

Mailing Adress: C/O Majeed Medical Store Near D.H.Q Hospital Bhakkar, Pakistan
Mobile:  +923317636681,
Mail:      rizwan_comsisian@...
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Dear Everyone :

Welcome you joing The First International Workshop on Flexible and Printable
Electronics 2009 (IWFPE 2009) in Korea.
Thank a lot


Frank Koo







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Dear ALl members :

Welcome visit the website of www.iwfpe2009.com
International Workshop on Flexible and Printable Electronics 2009 in Seoul Korea

Prof. Frank Koo


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Focused Ion Beam is best option


Sent via BlackBerry by AT&T

________________________________
From: Arun kumar <d_arun1981@...>
Date: Sat, 14 Nov 2009 03:25:11 -0600
To: PVD_coatings@yahoogroups.com<PVD_coatings@yahoogroups.com>
Subject: [PVD_coatings Forum] TEM - reg



Dear All,

Can anyone suggest how to scratch thin film samples to take TEM measurements.

Arun Kumar. D

[Non-text portions of this message have been removed]

Dear All,

         Can anyone suggest how to scratch thin film samples to take TEM
measurements.


Arun Kumar. D


       [Non-text portions of this message have been removed]

Call for Papers



The American Society of Mechanical Engineers (ASME) 10th Biennial Conference on
Engineering Systems Design and Analysis (ESDA 2010) will be held in Istanbul,
Turkey from 12 to 14 July 2010.



The conference will cover the whole spectrum of mechanical engineering field
(please see conference website for a complete list of topics at:

  http://www.asmeconferences.org/ESDA2010/
<http://www.asmeconferences.org/ESDA2010/>

I'd like to particularly encourage you to submit an abstract to the Advanced
Materials and Tribology Track Area. The main focus of this Track is on the
latest developments in materials and tribology fields.

In the field of tribology, the main emphasis will be on the fundamentals of
tribology (friction, wear and lubrication); surface engineering and treatments;
texturing; advanced tribological coatings (including superhard, nanocomposite,
and self-lubricating coatings like diamondlike carbon); engine and drivetrain
tribology; tribology of high speed machining; thermal and fluid dynamics in
lubricated contacts; transient conditions; lubrication fundamentals (including
hydrodynamic, mixed and boundary lubrication, tribochemistry); ecotribology;
contact mechanics; bearings and gears; seals; bio-tribology;
micro/nanotribology; MEMS and NEMS.

In the materials field, we will be emphasizing latest developments in
nanomaterials, metallic, composite, and polymeric materials; electronic and
optical materials; shape memory alloys; high temperature materials; materials
handling; corrosion and oxidation of materials; advances in materials processing
and manufacturing; modern casting and powder metallurgical techniques;
nondestructive testing; elasticity and viscoelasticity; computational materials
science and numerical simulations; materials in micro and nano-mechanical
systems and structures.

Important Dates

Abstract Submission Deadline

Author Notification of Abstract Acceptance

Submission of Full Paper for Review

Author Notification of Paper Acceptance

Submission of Copyright Form*

Submission of Final Accepted Paper

November 16, 2009

December 21, 2009

January 25, 2010

March 15, 2010

March 31, 2010

April 16, 2010

  *Copyright transfer forms are requested upon acceptance of the draft and prior
to the submittal of the final paper.

Programme

The scientific programme will consist of plenary lectures by invited keynote
speakers, invited sessions and contributed paper presentations. All contributed
papers will be subjected to a review process. All accepted papers will be
published by ASME <http://www.asme.org/>  as a CD of the proceedings. For each
accepted paper, at least one author is requested to register for the conference.

Venue

Yeditepe University has the advantage of being situated in Istanbul
<http://www.en.istanbul2010.org/INFO/index.htm> , the largest city in Europe and
the former capital of three empires (Eastern Roman, Byzantine and Ottoman). It
is a historical centre of Islam, Orthodox and Eastern Christianity. Since the
fall of the Ottoman Empire, Istanbul has continued to be the major city, if not
the titular capital the Republic of Turkiye, which has inspired 20th Century
movements of national liberation and secular reform. As the commercial centre of
modern Turkey, it continues to link Europe to Asia, and the Black Sea to the
Mediterranean. The people of Istanbul have roots, and continuing links with
Central Asia, the Caucasus, the Middle East and Europe. Owing to its unique
historical and cultural heritage and splendid natural beauties, Istanbul has
been selected as the "2010 European Culture Capital
<http://www.en.istanbul2010.org/index.htm> "

YouTube - ISTANBUL 2010 (European Capital of Culture)
<http://www.youtube.com/watch?v=znt5o0F2tVU>

Further Information

Further information can be obtained from the ESDA 2010 Conference website:

http://www.asmeconferences.org/ESDA2010/
<http://www.asmeconferences.org/ESDA2010/>



Ali Erdemir, Ph.D. (Materials and Tribology Track Chair)

Argonne National Laboratory

Energy Systems Division

Tribology Section

Argonne, IL 60439

USA

Erdemir@...

ID = 300 mm, OD = 550 mm, length = 250 mm

Material H13 high speed steel



Thanks





To: PVD_coatings@yahoogroups.com
From: Galco123@...
Date: Sun, 1 Nov 2009 20:16:46 -0500
Subject: Re: [PVD_coatings Forum] Arc coating of inside dialmeter of tube of an
Alumin...





WHAT IS THE DIAM OF THE TUBE

Marion

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_________________________________________________________________
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we are use pure titanium pallet . work piece material mainly HSS, CARBIDE OR D2
Etc.
for pre-cleaning we have 2 steps
1. hydro-carbon based ultra-sonic cleaning.mainly for clean oil & grease
2.different alkaline soluation based  ultra-sonic cleaning line.

vacuuam level at process starting time is 4*10-5. during coating mode it's
1.8*10-3 upper and lower
mode due to useing process gas. no leak found in machine.leak detection by
helium leak detectior.
leak detector supplyed by leybold vacuuam.




________________________________
From: Shoaib mirza <smirza_83@...>
To: pvd_coatings@yahoogroups.com
Sent: Fri, 30 October, 2009 6:14:48 PM
Subject: RE: [PVD_coatings Forum] colour failure & poor adhesion after coating

 

Dear Minoj,

Do you use pre-cleaning of your job before coating. There are many causes of
poor color and adhesion. Mention the material of work piece and also the target
you are using. I can definitely help you out in it.

with regards,
shoaib

Shoaib mirza

To: PVD_coatings@ yahoogroups. com
From: bhojmk@yahoo. in
Date: Sun, 25 Oct 2009 11:58:04 +0000
Subject: [PVD_coatings Forum] colour failure & poor adhesion after coating

we have a coating machine. coating height 240 mm.it's rod feed & curciable based
machine. titanium eveporation by ion bombardment.

during coating mode machine have two phase, one is lower for fixed time

second upper phase for fixed time.time depends on coating thickness.

what's the problem is, when upper phase coating, after coating colour

failure and poor adhension.

yours

manoj bhoj










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       Add whatever you love to the Yahoo! India homepage. Try now!
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[Non-text portions of this message have been removed]

Dear Everyone :

Welcome you joing The First International Workshop on Flexible and Printable
Electronics 2009 (IWFPE 2009) in Korea.
Thank a lot


Frank Koo

Hi:

Can't help with a machine, but a reference to inside coatings using vacuum arc
deposition can be found in

R.L. Boxman, S. Goldsmith, S. Shalev, H. Yaloz and N. Brosh, "Method and
Apparatus for Surface-Treating Workpieces", U.S. patent  4,645,895, Feb. 24,
1987; Israeli Patent 71530, Dec. 17, 1987. German patent 35 13 014, 24/03/1994.
Japanese Patent 1,906,448, Feb. 24, 1995.

Regards,
Ray
--- In PVD_coatings@yahoogroups.com, Zafar Iqbal <zafar1949@...> wrote:
>
>
> Hello there
>
>
>
> I am looking for a second hand arc coating machine which can coat inside ID of
the Al extrusion die. Any reference for research paper will be appreciated.
>
>
>
> Zafar
>
> _________________________________________________________________
> Keep your friends updated—even when you're not signed in.
>
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network-basics.aspx?ocid=PID23461::T:WLMTAGL:ON:WL:en-xm:SI_SB_5:092010
>
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>