CALL FOR PAPERS

ISLPED'07
INTERNATIONAL SYMPOSIUM ON LOW POWER ELECTRONICS AND DESIGN

http://www.islped.org

Portland, Oregon, USA

August 27-29, 2007


Sponsored by ACM SIGDA and IEEE Circuits and Systems Society with
technical co-sponsorship from the IEEE Solid-State Circuits Society
and the IEEE Electron Devices Society.

The International Symposium on Low Power Electronics and Design
(ISLPED) is the premier forum for presentation of recent advances in
all aspects of low power design and technologies, ranging from
process and circuit technologies, simulation and synthesis tools, to
system level design and optimization. Specific topics include, but
are not limited to, the following two main areas, each with three
sub-areas:

1. Architecture, Circuits, and Technology 2. Design Tools,
System and Software Design
1.1. Technologies and Digital Circuits
Emerging logic & memory technologies and applications,
Device design, Low power low leakage circuits,
Memory circuits, Cooling technologies, Battery technologies,
Variation-tolerant design, Temperature-aware and reliable design

2.1. Design Tools
Energy simulation and estimation tools that operate at
the circuit/gate level, RT level, behavioral level, and
algorithmic level, Variation-aware design, Physical
design and interconnects


1.2. Logic and Microarchitecture Design
Processor core design, Cache design, Logic and RTL
design, Arithmetic and signal processing circuits,
Encryption technologies, Asynchronous design

2.2. System Design and Methodologies
Microprocessor, DSP and embedded systems design,
FPGA and ASIC designs , Emerging applications,
Server thermal management, System level power
management, Behavioral and system level design aids


1.3. Analog, MEMS and Mixed Signal Electronics
RF circuits, Wireless, MEMS circuits, AD/DA
Converters, Mixed-signal circuits, DC-DC conversion

2.3. Software Design and Optimization
Power aware compiler and operating system design, Application
level optimizations, Wireless and sensor networks

Submissions on new topics: emerging technologies,
architectures/platforms, and applications are particularly
encouraged.

TECHNICAL PAPER SUBMISSIONS DEADLINE: Full papers should be
received by March 2, 2007. (no extention)

Submissions should be full-length papers of up to 6 pages (double-
column format, font size 9pt to 10pt), including all illustrations,
tables, references and an abstract of no more than 100 words. Papers
exceeding the six-page limit will not be reviewed. Electronic
submission in pdf format only via the web is required. More
information on electronic submission to ISLPED'07 can be found at
http://www.islped.org.

Submitted papers must describe original work that will not be
announced or published prior to the Symposium and that is not being
considered or under review by another conference at the same time.
Accepted papers will be presented in one of two parallel tracks: one
focusing on architectures, circuits and technologies, the other on
design tools and systems and software design for low power.
Notification of paper acceptance will be mailed by May 10, 2007 and
the camera-ready version of the paper will be due by May 30, 2007.
Accepted papers will be published in the Symposium Proceedings and
included in the annual ACM SIGDA CD-ROM Publication Compendium.
Authors of a few selected papers from the Symposium will also be
given an opportunity to submit enhanced versions of their papers for
publication in a special issue of a reputed journal. ISLPED'07 will
present two Best Paper Awards based on the ratings of reviewers and
an invited panel of judges.

INVITED TALK, PANEL, AND TUTORIAL PROPOSALS DEADLINE: RECEIVED by
April 15, 2007.

There will be several invited talks by industry and academic leaders
on key issues in low power electronics and design. All invited talks
will be in plenary sessions. The Symposium also may include embedded
tutorials to provide attendees with the necessary background to
follow recent research results, as well as panel discussions on
future directions and design/technology alternatives in low power
electronics and design. Proposals for invited talks, embedded
tutorials, and the panel should be sent to:

Ali Keshavarzi
Vijay Narayanan
Intel Corp. Penn State University
Portland, OR University Park, PA
ali.keshavarzi@...
vijay@...

Companies interested in exhibiting at the Symposium should contact
the Exhibits Chair by May 30, 2007.


Executive Committee and Symposium Officers

General Co-Chairs:

Diana Marculescu
Carnegie Mellon University
dianam@...

Anand Raghunathan
NEC Labs America
anand@...

Program Co-Chairs:

Ali Keshavarzi
Intel Corp.
ali.keshavarzi@...

Vijay Narayanan
Penn State University
vijay@...

Treasurer:

Tony Givargis
University of California, Irvine
givargis@...

Publicity Chairs:

Farzan Fallah
Fujitsu Labs. of America
farzan@...

C. P. Ravikumar
Texas Instruments
ravikumar@...

Liaisons:

Reiner Hartenstein (Europe)
TU Kaiserslautern
hartenst@...

Jihong Kim (Asia)
Seoul Natl. Univ.
jihong@...

Local Arrangements Chair:

Malgorzata Chrzanowska-Jeske
Portland State University
jeske@...

Design Contest Chairs:

Barry Pangrle
Atrenta
pangrle@...

Joerg Henkel
University of Karlsruhe
henkel@...

Exhibits Chair:

Qing Wu
SUNY University, Binghamton
qwu@...

Web Chair:

Yung-Hsiang Lu
Purdue University
yunglu@...